W sezonie promocyjnym duża ilość zamówień może powodować niewielkie opóźnienia w dostawie — dziękujemy za cierpliwość i zrozumienie!

SKU: 911-7E29-001

PRO B760-P DDR4 II

579,00 zł
inkl. MwSt

Termin dostawy

Zamów dzisiaj, a otrzymasz pakiet między 08 Grudzień - 10 Grudzień

Punkty MSI

Kupując ten produkt, możesz zdobyć około 87 punktów MSI, jeśli uczestniczysz już w programie nagród MSI.

Gwarancja

3 letnia gwarancja

Free Package

PRO B760-P DDR4 II

Business Elegance

The PRO B760-P DDR4 II is a business-oriented ATX motherboard featuring the latest Intel B760 chipset that supports ample RAM capacity.

Supports Intel Core 12th & 13th Gen Processors

The PRO B760-P DDR4 II motherboard supports 12th & 13th Gen Intel Core, Pentium Gold, and Celeron processors.

Form Factor: ATX

Socket Type: LGA 1700

Chipset: Intel B760

12+1 Duet Rail Power System with P-PAK

With its 8 pin + 4 pin power connectors and exclusive Core Boost technology, the PRO B760-P DDR4 II is able to sustain heavy CPU power loads to support system-demanding work settings:

1. Digital PWM IC

2. 12-Phase Duet Rail CPU Power (P-PAK)

3. 1-Phase GT Power

4. 1-Phase AUX Power

Integrated Cooling Features

VRM Cooling: Features an extended heatsink, 7W/mK MOSFET thermal pads and additional choke thermal pads for improved thermal dissipation.

PCB Cooling: Premium 6-layer printed circuit design with 2 oz. thickened copper improves heat dissipation & reliability.

SSD Cooling: M.2 Shield Frozr prevents thermal throttling.

System Cooling: Connect and synchronize cooling with strategically placed pin-headers - including a dedicated pump-fan header.

4 x DDR4 Dual Channel (5333 MHz OC)*

Memory Boost: A fully-isolated DDR circuit delivers pure data signals for optimal gaming and overclocking performance.

XMP profiles in MSI BIOS are MSI OC LAB optimized and can be easily enabled with auto power settings for optimized memory speed and stability.

*1DPC 1R Max. overclocking frequency 5333+ MHz, supports Intel XMP.

Fortified PCIe 4.0 x16 slots

MSI PCI Express Steel Armor slots are secured to the motherboard with extra solder points to support the weight of heavy graphics cards. When every advantage in games counts, Steel Armor also shields the point of contact from electromagnetic interference:

2 x PCIe 4.0/3.0 x16 slots* (primary slot with Steel Armor)

3 x PCIe 3.0 x1 slots

*Supports x16/x4

M.2 Shield Frozr

Even the world’s fastest SSDs will automatically slow if thermal throttling firmware detects excessively high temperatures.

M.2 Shield Frozr is MSI's most advanced thermal solution, offering the best possible protection to ensure maximum SSD transfer speed performance.

Lightning Gen4 M.2 Connectors

The PRO B760-P DDR4 II motherboard features MSI's Gen4 M.2 slots:

2 x Gen4 x4 64Gbps slots*

*1 with M.2 Shield Frozr

Connectivity

2.5G LAN: A Realtek 2.5Gbps LAN controller delivers a premium network experience.

USB 3.2 Gen 2 Type-C: Connect to devices and transfer files at high bandwidth rates: 10Gb/s.

HD Audio: 7.1-Channel High Definition Audio with Audio Boost.

Display Outputs: Include HDMI 2.1 (4K/60Hz) and DisplayPort 1.4 (4K/60Hz)

Sprawdź dokładny opis na stronie: www.msi.com

CECHY

  • Obsługa procesorów 14./13./12. gen. Intel® Core™, a także obsługa układów Intel® Pentium® Gold i Celeron® zgodnych z podstawką LGA 1700
  • Dwukanałowa obsługa pamięci DDR4 do 5333+ MHz (OC)
  • Wzmocniona konstrukcja zasilania: 12+1-fazowy system stopni zasilania zgodny z Duet Rail Power System z P-PAK, 8-pinowe i 4-pinowe złącza zasilania procesora oraz technologie Core Boost i Memory Boost
  • System chłodzenia klasy premium: Ulepszone radiatory Extended Heatsink, dodatkowe podkładki termiczne oraz system chłodzenia Shield Frozr zastosowano z myślą o wysokiej wydajności systemu i jego ciągłej, nieprzerwanej pracy
  • Najwyższej jakości płytka drukowana: 6-warstwowa płytka drukowana z dwoma uncjami rozmieszczonej warstwowo miedzi wykonana z materiałów klasy serwerowej
  • Wyjątkowa szybkość: złącza PCIe 4.0, Lightning Gen 4 x4 M.2
  • Intel Turbo USB 3.2 Gen 2: Wspierany przez kontroler Intel USB 3.2 Gen2, Turbo USB zapewnia nieprzerwane połączenie z większą stabilnością i najszybszymi prędkościami USB.
  • Karta sieciowe 2.5G LAN: Ulepszone rozwiązanie do zastosowań profesjonalnych i multimedialnych. Zapewnia bezpieczne, stabilne i szybkie połączenie sieciowe.
  • AUDIO BOOST: Generowanie dźwięku o jakości studyjnej pozwalającej uzyskać efekt wyjątkowego zanurzenia w grze

SPECYFIKACJA

Chipset INTEL B760
CPU Support Intel® Core™ 14th/ 13th/ 12th Gen Processors, Intel® Pentium® Gold and Celeron® Processors
LGA 1700
Memory 4x DDR4, Maximum Memory Capacity 128GB
Memory Support:
5333(OC)/ 5200(OC)/ 5066(OC)/ 5000(OC)/ 4800(OC)/
4600(OC)/ 4400(OC)/ 4266(OC)/ 4200(OC)/ 4000(OC)/
3800(OC)/ 3733(OC)/ 3600(OC)/ 3466(OC)/ 3400(OC)/
3333(OC)/ 3200(JEDEC)/ 2933(JEDEC)/ 2666(JEDEC)/
2400(JEDEC)/ 2133(JEDEC)
Max. overclocking frequency:
• 1DPC 1R Max speed up to 5333+ MHz
• 1DPC 2R Max speed up to 4800+ MHz
• 2DPC 1R Max speed up to 4400+ MHz
• 2DPC 2R Max speed up to 4000+ MHz

Supports Dual-Channel mode
Supports non-ECC, un-buffered memory
Supports Intel® Extreme Memory Profile (XMP)
Onboard Graphics 1x HDMI™
Support HDMI™ 2.1, maximum resolution of 4K 60Hz*
1x DisplayPort
Support DP 1.4, maximum resolution of 4K 60Hz*
*Available only on processors featuring integrated graphics.
Graphics specifications may vary depending on the CPU installed.

Slot 5x PCI-E x16 slot
PCI_E1 Gen PCIe 4.0 supports up to x16 (From CPU)
PCI_E2 Gen PCIe 3.0 supports up to x1 (From Chipset)
PCI_E3 Gen PCIe 4.0 supports up to x4 (From Chipset)
PCI_E4 Gen PCIe 3.0 supports up to x1 (From Chipset)
PCI_E5 Gen PCIe 3.0 supports up to x1 (From Chipset)
Storage 2x M.2
M.2_1 Source (From CPU) supports up to PCIe 4.0 x4 , supports 2280/2260/2242 devices
M.2_2 Source (From Chipset) supports up to PCIe 4.0 x4 , supports 2280/2260/2242 devices
4x SATA 6G
RAID Supports RAID 0, RAID 1, RAID 5 and RAID 10 for SATA storage devices
USB 2x USB 2.0 (Rear)
4x USB 2.0 (Front)
2x USB 3.2 Gen1 Type A (Rear)
4x USB 3.2 Gen1 Type A (Front)
1x USB 3.2 Gen1 Type C (Front)
1x USB 3.2 Gen2 Type C (Rear)
LAN Realtek® RTL8125BG 2.5G LAN
Audio Realtek® ALC897 Codec
7.1-Channel High Definition Audio
Supports S/PDIF output
Internal IO 1x Power Connector(ATX_PWR)
2x Power Connector(CPU_PWR)
1x CPU Fan
1x Pump Fan
5x System Fan
2x Front Panel (JFP)
1x Chassis Intrusion (JCI)
1x Front Audio (JAUD)
1x Com Port (JCOM)
1x TBT connector (JTBT, supports RTD3)
2x Addressable V2 RGB LED connector (JARGB_V2)
2x RGB LED connector(JRGB)
1x TPM pin header(Support TPM 2.0)
4x USB 2.0 ports
4x USB 3.2 Gen1 Type A ports
1x USB 3.2 Gen1 Type C ports
LED FEATURE 4x EZ Debug LED
BACK PANEL PORTS
  1. DisplayPort
  2. 2.5G LAN
  3. USB 2.0
  4. Audio Connectors
  5. HDMI™
  6. USB 3.2 Gen 1 5Gbps (Type-A)
  7. USB 3.2 Gen 2 10Gbps (Type-C)
  8. S/PDIF-OUT

OPERATING SYSTEM Support for Windows® 11 64-bit, Windows® 10 64-bit
PCB Info ATX
243.84mmx304.8mm
MSI Poland

PRO B760-P DDR4 II

579,00 zł

PRO B760-P DDR4 II

Business Elegance

The PRO B760-P DDR4 II is a business-oriented ATX motherboard featuring the latest Intel B760 chipset that supports ample RAM capacity.

Supports Intel Core 12th & 13th Gen Processors

The PRO B760-P DDR4 II motherboard supports 12th & 13th Gen Intel Core, Pentium Gold, and Celeron processors.

Form Factor: ATX

Socket Type: LGA 1700

Chipset: Intel B760

12+1 Duet Rail Power System with P-PAK

With its 8 pin + 4 pin power connectors and exclusive Core Boost technology, the PRO B760-P DDR4 II is able to sustain heavy CPU power loads to support system-demanding work settings:

1. Digital PWM IC

2. 12-Phase Duet Rail CPU Power (P-PAK)

3. 1-Phase GT Power

4. 1-Phase AUX Power

Integrated Cooling Features

VRM Cooling: Features an extended heatsink, 7W/mK MOSFET thermal pads and additional choke thermal pads for improved thermal dissipation.

PCB Cooling: Premium 6-layer printed circuit design with 2 oz. thickened copper improves heat dissipation & reliability.

SSD Cooling: M.2 Shield Frozr prevents thermal throttling.

System Cooling: Connect and synchronize cooling with strategically placed pin-headers - including a dedicated pump-fan header.

4 x DDR4 Dual Channel (5333 MHz OC)*

Memory Boost: A fully-isolated DDR circuit delivers pure data signals for optimal gaming and overclocking performance.

XMP profiles in MSI BIOS are MSI OC LAB optimized and can be easily enabled with auto power settings for optimized memory speed and stability.

*1DPC 1R Max. overclocking frequency 5333+ MHz, supports Intel XMP.

Fortified PCIe 4.0 x16 slots

MSI PCI Express Steel Armor slots are secured to the motherboard with extra solder points to support the weight of heavy graphics cards. When every advantage in games counts, Steel Armor also shields the point of contact from electromagnetic interference:

2 x PCIe 4.0/3.0 x16 slots* (primary slot with Steel Armor)

3 x PCIe 3.0 x1 slots

*Supports x16/x4

M.2 Shield Frozr

Even the world’s fastest SSDs will automatically slow if thermal throttling firmware detects excessively high temperatures.

M.2 Shield Frozr is MSI's most advanced thermal solution, offering the best possible protection to ensure maximum SSD transfer speed performance.

Lightning Gen4 M.2 Connectors

The PRO B760-P DDR4 II motherboard features MSI's Gen4 M.2 slots:

2 x Gen4 x4 64Gbps slots*

*1 with M.2 Shield Frozr

Connectivity

2.5G LAN: A Realtek 2.5Gbps LAN controller delivers a premium network experience.

USB 3.2 Gen 2 Type-C: Connect to devices and transfer files at high bandwidth rates: 10Gb/s.

HD Audio: 7.1-Channel High Definition Audio with Audio Boost.

Display Outputs: Include HDMI 2.1 (4K/60Hz) and DisplayPort 1.4 (4K/60Hz)

Sprawdź dokładny opis na stronie: www.msi.com

CECHY

  • Obsługa procesorów 14./13./12. gen. Intel® Core™, a także obsługa układów Intel® Pentium® Gold i Celeron® zgodnych z podstawką LGA 1700
  • Dwukanałowa obsługa pamięci DDR4 do 5333+ MHz (OC)
  • Wzmocniona konstrukcja zasilania: 12+1-fazowy system stopni zasilania zgodny z Duet Rail Power System z P-PAK, 8-pinowe i 4-pinowe złącza zasilania procesora oraz technologie Core Boost i Memory Boost
  • System chłodzenia klasy premium: Ulepszone radiatory Extended Heatsink, dodatkowe podkładki termiczne oraz system chłodzenia Shield Frozr zastosowano z myślą o wysokiej wydajności systemu i jego ciągłej, nieprzerwanej pracy
  • Najwyższej jakości płytka drukowana: 6-warstwowa płytka drukowana z dwoma uncjami rozmieszczonej warstwowo miedzi wykonana z materiałów klasy serwerowej
  • Wyjątkowa szybkość: złącza PCIe 4.0, Lightning Gen 4 x4 M.2
  • Intel Turbo USB 3.2 Gen 2: Wspierany przez kontroler Intel USB 3.2 Gen2, Turbo USB zapewnia nieprzerwane połączenie z większą stabilnością i najszybszymi prędkościami USB.
  • Karta sieciowe 2.5G LAN: Ulepszone rozwiązanie do zastosowań profesjonalnych i multimedialnych. Zapewnia bezpieczne, stabilne i szybkie połączenie sieciowe.
  • AUDIO BOOST: Generowanie dźwięku o jakości studyjnej pozwalającej uzyskać efekt wyjątkowego zanurzenia w grze

SPECYFIKACJA

Chipset INTEL B760
CPU Support Intel® Core™ 14th/ 13th/ 12th Gen Processors, Intel® Pentium® Gold and Celeron® Processors
LGA 1700
Memory 4x DDR4, Maximum Memory Capacity 128GB
Memory Support:
5333(OC)/ 5200(OC)/ 5066(OC)/ 5000(OC)/ 4800(OC)/
4600(OC)/ 4400(OC)/ 4266(OC)/ 4200(OC)/ 4000(OC)/
3800(OC)/ 3733(OC)/ 3600(OC)/ 3466(OC)/ 3400(OC)/
3333(OC)/ 3200(JEDEC)/ 2933(JEDEC)/ 2666(JEDEC)/
2400(JEDEC)/ 2133(JEDEC)
Max. overclocking frequency:
• 1DPC 1R Max speed up to 5333+ MHz
• 1DPC 2R Max speed up to 4800+ MHz
• 2DPC 1R Max speed up to 4400+ MHz
• 2DPC 2R Max speed up to 4000+ MHz

Supports Dual-Channel mode
Supports non-ECC, un-buffered memory
Supports Intel® Extreme Memory Profile (XMP)
Onboard Graphics 1x HDMI™
Support HDMI™ 2.1, maximum resolution of 4K 60Hz*
1x DisplayPort
Support DP 1.4, maximum resolution of 4K 60Hz*
*Available only on processors featuring integrated graphics.
Graphics specifications may vary depending on the CPU installed.

Slot 5x PCI-E x16 slot
PCI_E1 Gen PCIe 4.0 supports up to x16 (From CPU)
PCI_E2 Gen PCIe 3.0 supports up to x1 (From Chipset)
PCI_E3 Gen PCIe 4.0 supports up to x4 (From Chipset)
PCI_E4 Gen PCIe 3.0 supports up to x1 (From Chipset)
PCI_E5 Gen PCIe 3.0 supports up to x1 (From Chipset)
Storage 2x M.2
M.2_1 Source (From CPU) supports up to PCIe 4.0 x4 , supports 2280/2260/2242 devices
M.2_2 Source (From Chipset) supports up to PCIe 4.0 x4 , supports 2280/2260/2242 devices
4x SATA 6G
RAID Supports RAID 0, RAID 1, RAID 5 and RAID 10 for SATA storage devices
USB 2x USB 2.0 (Rear)
4x USB 2.0 (Front)
2x USB 3.2 Gen1 Type A (Rear)
4x USB 3.2 Gen1 Type A (Front)
1x USB 3.2 Gen1 Type C (Front)
1x USB 3.2 Gen2 Type C (Rear)
LAN Realtek® RTL8125BG 2.5G LAN
Audio Realtek® ALC897 Codec
7.1-Channel High Definition Audio
Supports S/PDIF output
Internal IO 1x Power Connector(ATX_PWR)
2x Power Connector(CPU_PWR)
1x CPU Fan
1x Pump Fan
5x System Fan
2x Front Panel (JFP)
1x Chassis Intrusion (JCI)
1x Front Audio (JAUD)
1x Com Port (JCOM)
1x TBT connector (JTBT, supports RTD3)
2x Addressable V2 RGB LED connector (JARGB_V2)
2x RGB LED connector(JRGB)
1x TPM pin header(Support TPM 2.0)
4x USB 2.0 ports
4x USB 3.2 Gen1 Type A ports
1x USB 3.2 Gen1 Type C ports
LED FEATURE 4x EZ Debug LED
BACK PANEL PORTS
  1. DisplayPort
  2. 2.5G LAN
  3. USB 2.0
  4. Audio Connectors
  5. HDMI™
  6. USB 3.2 Gen 1 5Gbps (Type-A)
  7. USB 3.2 Gen 2 10Gbps (Type-C)
  8. S/PDIF-OUT

OPERATING SYSTEM Support for Windows® 11 64-bit, Windows® 10 64-bit
PCB Info ATX
243.84mmx304.8mm
Zobacz produkt